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Artificial Intelligence Chip Market Size, Growth & Outlook

Artificial Intelligence Chip Market Size, Growth & Outlook
REPORT ID: FMI-0030 || VIEW: 87

Artificial Intelligence Chip Market by Chip Type (GPU, ASIC, FPGA, CPU, and others), Application (Natural Language Processing (NLP), Robotic, Computer Vision, Network Security, and Others), Technology (System-on-Chip, System-in-Package, Multi-chip Module, and Others), Processing Type (Edge and Cloud), and Industry Vertical (Media & Advertising, BFSI, IT & Telecom, Retail, Healthcare, Automotive & Transportation, and Others): Global Opportunity Analysis and Industry Forecast, 2019–2025
 

  • Report description
  • Table of Content

Artificial intelligence (AI) has been the most progressive technology since its introduction in the 1950s. It is associated with human intelligence with characteristics such as language understanding, reasoning, learning, problem-solving, and others. Manufacturers in the market witness enormous underlying intellectual challenges in the development and revision of such technology. It is positioned as the core of the next-generation software technologies in the market.

 

Artificial intelligence (AI) chips are specialized silicon chips, which incorporate AI technology and are used for machine learning. AI helps in eliminating or minimizing the risk to human life in many industry verticals. The need for more efficient systems for solving mathematical and computational problems becomes crucial, as the volume of data is increasing. Thus, majority of the key players in the IT industry have focused on developing AI chips and applications.

 

The factors that drive the growth of the global artificial intelligence chip market include increase in demand for smart homes, development of smart cities, and emergence of quantum computing. However, lack of skilled workforce restrains the market growth. Further, in the near future, increased adoption of AI chips in the developing regions and development of smarter robots are expected to provide lucrative opportunities for the key players operating in the global artificial intelligence chip market.

 

The global artificial intelligence chip market is segmented based on chip type, application, industry vertical, technology, and region. By chip type, the market is categorized into GPU, ASIC, FPGA, CPU, and others. Based on application, it is divided into natural language processing (NLP), robotic, computer vision, network security, and others. By technology, the market is segmented into system-on-chip, system-in-package, multi-chip module, and others. Based on processing type, it is bifurcated into edge and cloud. The industry verticals considered in the study include media & advertising, BFSI, IT & telecom, retail, healthcare, automotive & transportation, and others. Based on region, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.

 

The key players profiled in the report include Advanced Micro Devices (AMD), Google, Inc., Intel Corporation, NVIDIA, Baidu, Graphcore, Qualcomm, Adapteva, UC-Davis, Mythic, and others.

 

KEY BENEFITS FOR STAKEHOLDERS
• This study comprises analytical depiction of the global artificial intelligence chip market along with the current trends and future estimations to depict the imminent investment pockets.
• The overall market potential is determined to understand the profitable trends to gain a stronger coverage in the market.
• The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
• The current market is quantitatively analyzed from 2018 to 2025 to highlight the financial competency of the AI chip market.
• Porter’s five forces analysis illustrates the potency of the buyers and suppliers.

 

KEY MARKET SEGMENTS
BY CHIP TYPE
• GPU
• ASIC
• FPGA
• CPU
• Others

 

BY APPLICATION
• Natural Language Processing (NLP)
• Robotic
• Computer Vision
• Network Security
• Others

 

BY TECHNOLOGY
• System-on-Chip (SoC)
• System-in-Package (SIP)
• Multi-chip Module
• Others

 

BY PROCESSING TYPE
• Edge
• Cloud

 

BY INDUSTRY VERTICAL
• Media & Advertising
• BFSI
• IT & Telecom
• Retail
• Healthcare
• Automotive & Transportation
• Others

 

BY REGION
• North America
o U.S.
o Canada
o Mexico
• Europe
o UK
o Germany
o France
o Russia
o Rest of Europe
• Asia-Pacific
o China
o Japan
o India
o Australia
o Rest of Asia-Pacific
• LAMEA
o Latin America
o Middle East
o Africa

 

KEY MARKET PLAYERS PROFILED
• Advanced Micro Devices (AMD)
• Google, Inc.
• Intel Corporation
• NVIDIA
• Baidu
• Graphcore
• Qualcomm
• Adapteva
• UC-Davis
• Mythic
• Others

CHAPTER 1: INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. INDUSTRY ROADMAP
2.2. CXO PERSPECTIVE

CHAPTER 3: MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies

3.3. PORTER’S FIVE FORCES ANALYSIS
3.4. AI CHIP MARKET – VALUE CHAIN ANALYSIS
3.5. MARKET SHARE ANALYSIS, 2018

3.5.1. AI Chip Suppliers, by Vertical

3.5.1.1. Media & Advertising
3.5.1.2. BFSI
3.5.1.3. IT & Telecom
3.5.1.4. Retail
3.5.1.5. Healthcare
3.5.1.6. Automotive

3.5.2. AI Chip Supplier Market Share Analysis, by Verticals

3.5.2.1. IT & Telecom
3.5.2.2. BFSI
3.5.2.3. Media & Advertising
3.5.2.4. Healthcare
3.5.2.5. Automotive
3.5.2.6. Retail

3.5.3. AI Chip Customers, by Vertical

3.5.3.1. Media & Advertising
3.5.3.2. BFSI
3.5.3.3. IT & Telecom
3.5.3.4. Retail
3.5.3.5. Healthcare
3.5.3.6. Automotive

3.5.4. Market share and AI chip spend for top customers

3.6. MARKET DYNAMICS

3.6.1. Drivers

3.6.1.1. Increase in demand for smart homes & smart cities
3.6.1.2. Rise in investments in AI startups
3.6.1.3. Emergence of quantum computing

3.6.2. Restraint

3.6.2.1. Dearth of skilled workforce

3.6.3. Opportunities

3.6.3.1. Increased adoption of AI chips in the developing regions
3.6.3.2. Development of smarter robots

3.7. RACE ANALYSIS
3.8. PATENT ANALYSIS

CHAPTER 4: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY CHIP TYPE

4.1. OVERVIEW
4.2. GPU

4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis by country

4.3. ASIC

4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis by country

4.4. FPGA

4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis by country

4.5. CPU

4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market analysis by country

4.6. OTHERS (NPU & HYBRID CHIP)

4.6.1. Key market trends, growth factors, and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market analysis by country

CHAPTER 5: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY APPLICATION

5.1. OVERVIEW
5.2. NATURAL LANGUAGE PROCESSING (NLP)

5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis by country

5.3. ROBOTIC PROCESS AUTOMATION

5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis by country

5.4. COMPUTER VISION

5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis by country

5.5. NETWORK SECURITY

5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis by country

5.6. OTHERS

5.6.1. Key market trends, growth factors, and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market analysis by country

CHAPTER 6: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY TECHNOLOGY

6.1. OVERVIEW
6.2. SYSTEM-ON-CHIP (SOC)

6.2.1. Key market trends, growth factors and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis by country

6.3. SYSTEM-IN-PACKAGE (SIP)

6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis by country

6.4. MULTI-CHIP MODULE

6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis by country

6.5. OTHERS (PACKAGE IN PACKAGE, TSV)

6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by region
6.5.3. Market analysis by country

CHAPTER 7: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY PROCESSING TYPE

7.1. OVERVIEW
7.2. EDGE

7.2.1. Key market trends, growth factors and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market analysis by country

7.3. CLOUD

7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market analysis by country

CHAPTER 8: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY INDUSTRY VERTICAL

8.1. OVERVIEW
8.2. MEDIA & ADVERTISING

8.2.1. Content Management
8.2.2. User Data Management
8.2.3. Real time analytics
8.2.4. Planning and scheduling
8.2.5. Key market trends, growth factors and opportunities
8.2.6. Market size and forecast, by region
8.2.7. Market analysis by country
8.2.8. Market size and forecast, by processing type

8.3. BFSI

8.3.1. Virtual Personal Assistant
8.3.2. Risk Management
8.3.3. Fraud Detection
8.3.4. Key market trends, growth factors and opportunities
8.3.5. Market size and forecast, by region
8.3.6. Market analysis by country
8.3.7. Market size and forecast, by processing type

8.4. IT & TELECOM

8.4.1. Churn Prediction
8.4.2. Network optimization
8.4.3. Virtual Assistance
8.4.4. Preventive Maintenance
8.4.5. Key market trends, growth factors and opportunities
8.4.6. Market size and forecast, by region
8.4.7. Market analysis by country
8.4.8. Market size and forecast, by processing type

8.5. RETAIL

8.5.1. Virtual Assistance
8.5.2. Demand planning and scheduling
8.5.3. Payment service management
8.5.4. Loyalty Management
8.5.5. Key market trends, growth factors and opportunities
8.5.6. Market size and forecast, by region
8.5.7. Market analysis by country
8.5.8. Market size and forecast, by processing type

8.6. HEALTHCARE

8.6.1. Risk Analysis
8.6.2. Imaging and diagnostics
8.6.3. Drug Discovery
8.6.4. Wearables
8.6.5. Key market trends, growth factors and opportunities
8.6.6. Market size and forecast, by region
8.6.7. Market analysis by country
8.6.8. Market size and forecast, by processing type

8.7. AUTOMOTIVE

8.7.1. Image Recognition
8.7.2. Control Devices
8.7.3. Key market trends, growth factors and opportunities
8.7.4. Market size and forecast, by region
8.7.5. Market analysis by country
8.7.6. Market size and forecast, by processing type

8.8. OTHERS

8.8.1. Key market trends, growth factors and opportunities
8.8.2. Market size and forecast, by region
8.8.3. Market analysis by country
8.8.4. Market size and forecast, by processing type

CHAPTER 9: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY REGION

9.1. OVERVIEW
9.2. NORTH AMERICA

9.2.1. Key market trends, growth factors, and opportunities
9.2.2. Market size and forecast, by chip type
9.2.3. Market size and forecast, by application
9.2.4. Market size and forecast, by technology
9.2.5. Market size and forecast, by processing type
9.2.6. Market size and forecast, by industry vertical
9.2.7. Market analysis by country

9.2.7.1. U.S.

9.2.7.1.1. Market size and forecast, by chip type
9.2.7.1.2. Market size and forecast, by application
9.2.7.1.3. Market size and forecast, by technology
9.2.7.1.4. Market size and forecast, by processing type
9.2.7.1.5. Market size and forecast, by industry vertical

9.2.7.2. Canada

9.2.7.2.1. Market size and forecast, by chip type
9.2.7.2.2. Market size and forecast, by application
9.2.7.2.3. Market size and forecast, by technology
9.2.7.2.4. Market size and forecast, by processing type
9.2.7.2.5. Market size and forecast, by industry vertical

9.2.7.3. Mexico

9.2.7.3.1. Market size and forecast, by chip type
9.2.7.3.2. Market size and forecast, by application
9.2.7.3.3. Market size and forecast, by technology
9.2.7.3.4. Market size and forecast, by processing type
9.2.7.3.5. Market size and forecast, by industry vertical

9.3. EUROPE

9.3.1. Key market trends, growth factors, and opportunities
9.3.2. Market size and forecast, by chip type
9.3.3. Market size and forecast, by application
9.3.4. Market size and forecast, by technology
9.3.5. Market size and forecast, by processing type
9.3.6. Market size and forecast, by industry vertical
9.3.7. Market analysis by country

9.3.7.1. U.K.

9.3.7.1.1. Market size and forecast, by chip type
9.3.7.1.2. Market size and forecast, by application
9.3.7.1.3. Market size and forecast, by technology
9.3.7.1.4. Market size and forecast, by processing type
9.3.7.1.5. Market size and forecast, by industry vertical

9.3.7.2. Germany

9.3.7.2.1. Market size and forecast, by chip type
9.3.7.2.2. Market size and forecast, by application
9.3.7.2.3. Market size and forecast, by technology
9.3.7.2.4. Market size and forecast, by processing type
9.3.7.2.5. Market size and forecast, by industry vertical

9.3.7.3. France

9.3.7.3.1. Market size and forecast, by chip type
9.3.7.3.2. Market size and forecast, by application
9.3.7.3.3. Market size and forecast, by technology
9.3.7.3.4. Market size and forecast, by processing type
9.3.7.3.5. Market size and forecast, by industry vertical

9.3.7.4. Russia

9.3.7.4.1. Market size and forecast, by chip type
9.3.7.4.2. Market size and forecast, by application
9.3.7.4.3. Market size and forecast, by technology
9.3.7.4.4. Market size and forecast, by processing type
9.3.7.4.5. Market size and forecast, by industry vertical

9.3.7.5. Rest of Europe

9.3.7.5.1. Market size and forecast, by chip type
9.3.7.5.2. Market size and forecast, by application
9.3.7.5.3. Market size and forecast, by technology
9.3.7.5.4. Market size and forecast, by processing type
9.3.7.5.5. Market size and forecast, by industry vertical

9.4. ASIA-PACIFIC

9.4.1. Key market trends, growth factors, and opportunities
9.4.2. Market size and forecast, by chip type
9.4.3. Market size and forecast, by application
9.4.4. Market size and forecast, by technology
9.4.5. Market size and forecast, by processing type
9.4.6. Market size and forecast, by industry vertical
9.4.7. Market analysis by country

9.4.7.1. China

9.4.7.1.1. Market size and forecast, by chip type
9.4.7.1.2. Market size and forecast, by application
9.4.7.1.3. Market size and forecast, by technology
9.4.7.1.4. Market size and forecast, by processing type
9.4.7.1.5. Market size and forecast, by industry vertical

9.4.7.2. Japan

9.4.7.2.1. Market size and forecast, by chip type
9.4.7.2.2. Market size and forecast, by application
9.4.7.2.3. Market size and forecast, by technology
9.4.7.2.4. Market size and forecast, by processing type
9.4.7.2.5. Market size and forecast, by industry vertical

9.4.7.3. India

9.4.7.3.1. Market size and forecast, by chip type
9.4.7.3.2. Market size and forecast, by application
9.4.7.3.3. Market size and forecast, by technology
9.4.7.3.4. Market size and forecast, by processing type
9.4.7.3.5. Market size and forecast, by industry vertical

9.4.7.4. Australia

9.4.7.4.1. Market size and forecast, by chip type
9.4.7.4.2. Market size and forecast, by application
9.4.7.4.3. Market size and forecast, by technology
9.4.7.4.4. Market size and forecast, by processing type
9.4.7.4.5. Market size and forecast, by industry vertical

9.4.7.5. Rest of Asia-Pacific

9.4.7.5.1. Market size and forecast, by chip type
9.4.7.5.2. Market size and forecast, by application
9.4.7.5.3. Market size and forecast, by technology
9.4.7.5.4. Market size and forecast, by processing type
9.4.7.5.5. Market size and forecast, by industry vertical

9.5. LAMEA

9.5.1. Key market trends, growth factors, and opportunities
9.5.2. Market size and forecast, by chip type
9.5.3. Market size and forecast, by application
9.5.4. Market size and forecast, by technology
9.5.5. Market size and forecast, by processing type
9.5.6. Market size and forecast, by industry vertical
9.5.7. Market analysis by country

9.5.7.1. Latin America

9.5.7.1.1. Market size and forecast, by chip type
9.5.7.1.2. Market size and forecast, by application
9.5.7.1.3. Market size and forecast, by technology
9.5.7.1.4. Market size and forecast, by processing type
9.5.7.1.5. Market size and forecast, by industry vertical

9.5.7.2. Middle East

9.5.7.2.1. Market size and forecast, by chip type
9.5.7.2.2. Market size and forecast, by application
9.5.7.2.3. Market size and forecast, by technology
9.5.7.2.4. Market size and forecast, by processing type
9.5.7.2.5. Market size and forecast, by industry vertical

9.5.7.3. Africa

9.5.7.3.1. Market size and forecast, by chip type
9.5.7.3.2. Market size and forecast, by application
9.5.7.3.3. Market size and forecast, by technology
9.5.7.3.4. Market size and forecast, by processing type
9.5.7.3.5. Market size and forecast, by industry vertical

CHAPTER 10: COMPANY PROFILES

10.1. ADAPTEVA, INC.

10.1.1. Company overview
10.1.2. Company snapshot
10.1.3. Product portfolio
10.1.4. Key strategic moves and developments
10.1.5. Technological insights and key architecture

10.2. ADVANCED MICRO DEVICES, INC.

10.2.1. Company overview
10.2.2. Company snapshot
10.2.3. Operating business segments
10.2.4. Product portfolio
10.2.5. Business performance
10.2.6. Key strategic moves and developments
10.2.7. Technological insights and key architecture

10.3. ALPHABET INC. (GOOGLE INC.)

10.3.1. Company overview
10.3.2. Company snapshot
10.3.3. Operating business segments
10.3.4. Product portfolio
10.3.5. Business performance
10.3.6. Key strategic moves and developments
10.3.7. Technological insights and key architecture

10.4. AMAZON.COM, INC.

10.4.1. Company overview
10.4.2. Company snapshot
10.4.3. Operating business segments
10.4.4. Product portfolio
10.4.5. Business performance
10.4.6. Key strategic moves and developments
10.4.7. Technological insights and key architecture

10.5. ANALOG DEVICES, INC.

10.5.1. Company overview
10.5.2. Company snapshot
10.5.3. Operating business segments
10.5.4. Product portfolio
10.5.5. Business performance
10.5.6. Technological insights and key architecture

10.6. APPLIED MATERIALS, INC.

10.6.1. Company overview
10.6.2. Company snapshot
10.6.3. Operating business segments
10.6.4. Product portfolio
10.6.5. Business performance
10.6.6. Key strategic moves and developments
10.6.7. Technological insights and key architecture

10.7. BAIDU, INC.

10.7.1. Company overview
10.7.2. Company snapshot
10.7.3. Operating business segments
10.7.4. Product portfolio
10.7.5. Business performance
10.7.6. Key strategic moves and developments
10.7.7. Technological insights and key architecture

10.8. BITMAIN TECHNOLOGIES LTD.

10.8.1. Company overview
10.8.2. Company snapshot
10.8.3. Product portfolio
10.8.4. Key strategic moves and developments
10.8.5. Technological insights and key architecture

10.9. BROADCOM LIMITED

10.9.1. Company overview
10.9.2. Company snapshot
10.9.3. Operating business segments
10.9.4. Product portfolio
10.9.5. Business performance
10.9.6. Key strategic moves and developments
10.9.7. Technological insights and key architecture

10.10. CAMBRICON TECHNOLOGIES CORPORATION LIMITED

10.10.1. Company overview
10.10.2. Company snapshot
10.10.3. Operating business segments
10.10.6. Technological insights and key architecture

10.11. GRAPHCORE LTD.

10.11.1. Company overview
10.11.2. Company snapshot
10.11.3. Operating business segments
10.11.4. Product portfolio
10.11.5. Key strategic moves and developments
10.11.6. Technological insights and key architecture

10.12. GROQ

10.12.1. Company overview
10.12.2. Company snapshot
10.12.3. Product portfolio
10.12.4. Technological insights and key architecture

10.13. GYRFALCON TECHNOLOGY INC.

10.13.1. Company overview
10.13.2. Company snapshot
10.13.3. Operating business segments
10.13.4. Product portfolio
10.13.5. Technological insights and key architecture

10.14. HORIZON ROBOTICS, INC.

10.14.1. Company overview
10.14.2. Company snapshot
10.14.3. Product portfolio
10.14.4. Technological insights and key architecture

10.15. HUAWEI TECHNOLOGIES CO. LTD.

10.15.1. Company overview
10.15.2. Company snapshot
10.15.3. Operating business segments
10.15.4. Product portfolio
10.15.5. Business performance
10.15.6. Key strategic moves and developments
10.15.7. Technological insights and key architecture

10.16. INTEL CORPORATION

10.16.1. Company overview
10.16.2. Company snapshot
10.16.3. Operating business segments
10.16.4. Product portfolio
10.16.5. Business performance
10.16.6. Key strategic moves and developments
10.16.7. Technological insights and key architecture

10.17. INTERNATIONAL BUSINESS MANAGEMENT CORPORATION

10.17.1. Company overview
10.17.2. Company snapshot
10.17.3. Operating business segments
10.17.4. Product portfolio
10.17.5. Business performance
10.17.6. Key strategic moves and developments
10.17.7. Technological insights and key architecture

10.18. KNUEDGE, INC.

10.18.1. Company overview
10.18.2. Company snapshot
10.18.3. Product portfolio
10.18.4. Technological insights and key architecture

10.19. KRTKL INC.

10.19.1. Company overview
10.19.2. Company snapshot
10.19.3. Product portfolio
10.19.4. Technological insights and key architecture

10.20. MEDIATEK, INC.

10.20.1. Company overview
10.20.2. Company snapshot
10.20.3. Operating business segments
10.20.4. Product portfolio
10.20.5. Business performance
10.20.6. Key strategic moves and developments
10.20.7. Technological insights and key architecture

10.21. MICRON TECHNOLOGY, INC.

10.21.1. Company overview
10.21.2. Company snapshot
10.21.3. Operating business segments
10.21.4. Product portfolio
10.21.5. Business performance
10.21.6. Technological insights and key architecture

10.22. MICROSEMI CORPORATION

10.22.1. Company overview
10.22.2. Company snapshot
10.22.3. Operating business segments
10.22.4. Product portfolio
10.22.5. Business performance
10.22.6. Key strategic moves and developments
10.22.7. Technological insights and key architecture

10.23. MYTHIC, INC.

10.23.1. Company overview
10.23.2. Company snapshot
10.23.3. Product portfolio
10.23.4. Key strategic moves and developments
10.23.5. Technological insights and key architecture

10.24. NEC CORPORATION

10.24.1. Company overview
10.24.2. Company snapshot
10.24.3. Operating business segments
10.24.4. Product portfolio
10.24.5. Business performance
10.24.6. Key strategic moves and developments
10.24.7. Technological insights and key architecture

10.25. KOREA ELECTRONIC CERTIFICATION AUTHORITY, INC. (AI BRAIN, INC.)

10.25.1. Company overview
10.25.2. Company snapshot
10.25.3. Operating business segments
10.25.4. Product portfolio
10.25.5. Technological insights and key architecture

10.26. NVIDIA CORPORATION

10.26.1. Company overview
10.26.2. Company snapshot
10.26.3. Operating business segments
10.26.4. Product portfolio
10.26.5. Business performance
10.26.6. Key strategic moves and developments
10.26.7. Technological insights and key architecture

10.27. NXP SEMICONDUCTORS N.V.

10.27.1. Company overview
10.27.2. Company snapshot
10.27.3. Operating business segments
10.27.4. Product portfolio
10.27.5. Business performance
10.27.6. Key strategic moves and developments
10.27.7. Technological insights and key architecture

10.28. QUALCOMM INCORPORATED

10.28.1. Company overview
10.28.2. Company snapshot
10.28.3. Operating business segments
10.28.4. Product portfolio
10.28.5. Business performance
10.28.6. Key strategic moves and developments
10.28.7. Technological insights and key architecture

10.29. SAMSUNG ELECTRONICS CO. LTD.

10.29.1. Company overview
10.29.2. Company snapshot
10.29.3. Operating business segments
10.29.4. Product portfolio
10.29.5. Business performance
10.29.6. Key strategic moves and developments
10.29.7. Technological insights and key architecture

10.30. SHANGHAI THINK-FORCE ELECTRONIC TECHNOLOGY CO. LTD.

10.30.1. Company overview
10.30.2. Company snapshot
10.30.3. Product portfolio
10.30.4. Technological insights and key architecture

10.31. SK HYNIX, INC.

10.31.1. Company overview
10.31.2. Company snapshot
10.31.3. Operating business segments
10.31.4. Product portfolio
10.31.5. Business performance
10.31.6. Technological insights and key architecture

10.32. SOFTBANK GROUP CORP. (ARM HOLDINGS PLC)

10.32.1. Company overview
10.32.2. Company snapshot
10.32.3. Operating business segments
10.32.4. Product portfolio
10.32.5. Business performance
10.32.6. Key strategic moves and developments
10.32.7. Technological insights and key architecture

10.33. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

10.33.1. Company overview
10.33.2. Company snapshot
10.33.3. Operating business segments
10.33.4. Product portfolio
10.33.5. Business performance
10.33.6. Technological insights and key architecture

10.34. TENSTORRENT INC.

10.34.1. Company overview
10.34.2. Company snapshot
10.34.3. Product portfolio
10.34.4. Technological insights and key architecture

10.35. TEXAS INSTRUMENTS INCORPORATED

10.35.1. Company overview
10.35.2. Company snapshot
10.35.3. Operating business segments
10.35.4. Product portfolio
10.35.5. Business performance
10.35.6. Technological insights and key architecture

10.36. TOSHIBA CORPORATION

10.36.1. Company overview
10.36.2. Company snapshot
10.36.3. Operating business segments
10.36.4. Product portfolio
10.36.5. Business performance
10.36.6. Key strategic moves and developments
10.36.7. Technological insights and key architecture

10.37. UNIVERSITY OF CALIFORNIA SYSTEM (UNIVERSITY OF CALIFORNIA, DAVIS)

10.37.1. Company overview
10.37.2. Company snapshot
10.37.3. Operating business segments
10.37.4. Product portfolio
10.37.5. Business performance
10.37.6. Technological insights and key architecture

10.38. WAVE COMPUTING, INC.

10.38.1. Company overview
10.38.2. Company snapshot
10.38.3. Product portfolio
10.38.4. Key strategic moves and developments
10.38.5. Technological insights and key architecture

10.39. XILINX, INC.

10.39.1. Company overview
10.39.2. Company snapshot
10.39.3. Operating business segments
10.39.4. Product portfolio
10.39.5. Business performance
10.39.6. Technological insights and key architecture

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